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The Sensorise QoSim® (M2M SIM) is a dedicated platform specifically designed for environments where standard plug-in SIM cards are not suitable, either for space, or for environmental reasons. The QoSim® (M2M SIM) is a solution that combines traditional smart card security with a more rugged form factor.
This SIM card has a specific form factor i.e. MFF2, which is a JDEC SON-8 intended to be soldered to the Printed Circuit Board (PCB) in a M2M device and is of Automotive Grade. This document provides information about the physical and electrical characteristics of this form factor. Extended life operating system is a M2M specific operating system especially designed to maximize the lifespan of the memory chip, making it more resistant to stress (erase/write cycles) and allowing to have a very low failure rate.
In addition to the form factor the Sensorise QoSim® comes with advanced features such as
- Multi operator profiles for maximizing the connectivity for mission critical use cases
- Remote locking (and blocking) of the QoSim to a device
- Remote diagnostic for tracing connectivity problems
QoSim® Package Feature
| Package | SON-8 (UELP, QFN, DFN) according to JEDEC Publication 95 Design Guide 4.8 / ETSI TS 102 671 Rel-9 – MFF2 package layout |
| Dimensions | 6 x 5 mm |
| Operating Temperature | -40°C to +105°C |
| Data Retention | 17 years at 85°C 10 years at 105°C |
| Memory Endurance | 500’000 cycle May be enhanced to 1 million plus R/E operations for frequently R/E memory areas by software algorithm |
| Available Memory | 128 kB or more |
| Operating Voltage | 1.62V – 5V (Support of Voltage classes A, B and C) |
| Electrical Features | ISO7816 |
| Automotive Grade Compliance | AECQ100 Rev H |
| ESG Protection | >4KV HBM |
Embedded Security
| Authentication Algorithms | Comp-128 v3, Comp 128 v4, Milenage |
| Symmetric Algorithms | DES, 3DES, AES |
| SW and HW counter measures | Single power attacks (SPA) Differential power attacks (DPA) Fault attacks (FA) |
Physical Features
| Parameter | Description | Dimensions (mm) |
| E | The package body dimension in the horizontal direction. | 6.00 ±0.15 |
| D | The package body dimension in the vertical direction. | 5.00 ±0.15 |
| L | The length of the contact as measured from the edge of the package. | 0.60 ±0.15 |
| b | The width of the metallised contacts (including lead finish) exposed at the bottom surface of the package. | 0.40 ±0.10 |
| E2 | The horizontal dimension of the exposed metal heat feature (exposed die pad). | Min 3.30 |
| D2 | The vertical dimension of the exposed metal heat feature (exposed die pad). | Min 3,90 |
| k | The gap between any contact and the heat feature. | Min 0.20 |
| e | The center line-to-center line spacing of the contacts. | 1.27 |
Contacts
The logical definition of the contacts C1 to C8 shall be as defined in TS 102 221, see also section 4
| Terminal | ETSI Contact Number | Name | Function |
| 1 | C5 | GND | Ground |
| 2 | C6 | NC | Not Connected |
| 3 | C7 | I/O | Serial Data |
| 4 | C8 | NC | Not Connected |
| 5 | C4 | NC | Not Connected |
| 6 | C3 | CLK | External Clock Input |
| 7 | C2 | RST | System Reset Input |
| 8 | C1 | VCC | Power |
Soldering Profile
Compliant with standard JEDEC J-STD-020C:
- Package classification reflow temperature: 260°C
- Lead free packaging compliant to the European Directive for Restriction of Hazardous Substances (RoHS directive)
- Moisture Sensitivity Level: 3
- Floor Life Time: 168H
Electrical Characteristics
The following subsections contains the required characteristics for further details see ETSI TS 102 221
Class A Operating Conditions
| Contact | Name | Symbol | Conditions | Min | Max | Unit |
| C1 | VCC | VCC | 5.5 | 5.5 | V | |
| C2 | RST | VOH | IOHmax = +20 uA | 0.7 x VCC | VCC | V |
| VOL | IOHmax = -200 uA | 0 | 0.6 | V | ||
| tR tF | Cin = Cout= 30 pF | 400 | us | |||
| C3 | CLK | VOH | IOHmax = +20 uA | 0.7 x VCC | VCC | V |
| VOL | IOHmax = -200 uA | 0 | 0.5 | V | ||
| tR tF | Cin = Cout= 30 pF | 9% of period with a maximum of 0,5 µs |
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| C7 | I/O | VIH | IIHmax = ± 20 uA | 0.7 x VCC | VCC + 0.3 | V |
| VIL | IILmax = + 1 mA | -0.3 | 0.15 x VCC | V | ||
| VOH | IOHmax = + 20 uA | 3.8 | VCC | V | ||
| VOL | IOHmax = -1 mA | 0 | 1 | V | ||
| tR tF | Cin = Cout= 30 pF | 1 | s |
Class B Operating Conditions
| Contact | Name | Symbol | Conditions | Min | Max | Unit |
| C1 | VCC | VCC | 2.7 | 3.3 | V | |
| C2 | RST | VOH | IOHmax = +20 uA | 0.8 x VCC | VCC | V |
| VOL | IOHmax = -200 uA | 0 | 0.2 x VCC | V | ||
| tR tF | Cin = Cout= 30 pF | 400 | us | |||
| C3 | CLK | VOH | IOHmax = +20 uA | 0.7 x VCC | VCC | V |
| VOL | IOHmax = -20 uA | 0 | 0.2 x VCC | V | ||
| tR tF | Cin = Cout= 30 pF | 400 | uS | |||
| C7 | I/O | VIH | IIHmax = ± 20 uA | 0.7 x VCC | VCC + 0.3 | V |
| VIL | IILmax = + 1 mA | -0.3 | 0.2 x VCC | V | ||
| VOH | IOHmax = + 20 uA | 0.7 x VCC | VCC + 0.3 | V | ||
| VOL | IOHmax = -1 mA | 0 | 0.4 | V | ||
| tR tF | Cin = Cout= 30 pF | 1 | us |
Class C Operating Conditions
| Contact | Name | Symbol | Conditions | Min | Max | Unit |
| C1 | VCC | VCC | 1.62 | 1.98 | V | |
| C2 | RST | VOH | IOHmax = +20 uA | 0.8 x VCC | VCC | V |
| VOL | IOHmax = -200 uA | 0 | 0.2 x VCC | V | ||
| tR tF | Cin = Cout= 30 pF | 400 | us | |||
| C3 | CLK | VOH | IOHmax = +20 uA | 0.7 x VCC | VCC | V |
| VOL | IOHmax = -20 uA | 0 | 0.2 x VCC | V | ||
| tR tF | Cin = Cout= 30 pF | 50 | nS | |||
| C7 | I/O | VIH | IIHmax = ± 20 uA | 0.7 x VCC | VCC + 0.3 | V |
| VIL | IILmax = + 1 mA | -0.3 | 0.2 x VCC | V | ||
| VOH | IOHmax = + 20 uA | 0.7 x VCC | VCC | V | ||
| VOL | IOHmax = -1 mA | 0 | 0.3 | V | ||
| tR tF | Cin = Cout= 30 pF | 100 | us |
Packaging
Sensorise delivers the QoSim® package in volumes using tape reel packing method, in either 1000 pieces or 3000 pieces per reel.
The shelf-life for dry-packed SMD packages shall be a minimum of 12 months from the bag seal date, when stored in a non-condensing atmospheric environment of <40 °C/90% RH.
For certain restricted requirements, Sensorise may be able to support packages in reel size of 100.
Part Number
The QoSim® Assure Dual SMD Automotive is given a part number 208DECxCZ.
The small x is an identifier that takes on values exemplified below:
x = I, when the chip is Infineon Make; Part Number 208DECICZ
x = S, when the chip is ST Microelectronics Make; Part Number 208DECICZ
Standards Compliance
| Document | Name | Version |
| ISO 7816 Parts 1&3 | Identification cards-Integrated circuit(s) cards with contacts, Part 1: Physical characteristics. Part 3: Electronic signals and transmission protocols | V2004 |
| Java Card | Java Card Virtual Machine Specification | JC2.2.1 |
| Global Platform | Global Platform Card Specification | GP2.1.1 |
| 3GPP TS 23.040 | Technical realization of Short Message Service (SMS) Point-To-Point | Release 6 |
| 3GPP TS 23.041 | Technical realization of Short Message Service (SMS) Cell Broadcast | Release 6 |
| 3GPP TS 23.048 | Security Mechanisms for the SIM application toolkit; Stage 2 | V5.8.0 |
| 3GPP TS 31.101 | UICC-Terminal Interface; Physical and Logical Characteristics | Release 6 |
| 3GPP TS 31.102 | Characteristics of the USIM Application | Release 6 |
| 3GPP TS 31.110 | Numbering system for telecommunication IC card applications | V4.1.0 |
| 3GPP TS 31.111 | USIM Application Toolkit (USAT) | Release 6 |
| 3GPP TS 31.115 | Secured packet structure for (U)SIM Toolkit applications | Release 6 |
| 3GPP TS 31.116 | Remote APDU Structure for (U)SIM Toolkit applications | Release 6 |
| TS 31.130 | (U)SIM Application Programming Interface API; (U)SIM API for Java Card(TM) (ETSI 102.241 – UICC API) | Release 6 |
| 3GPP TS 43.019 | Specification of the SIM Application Programming Interface For Java Card | Release 6 |
| 3GPP TS 51.011 | Specification of the Subscriber Identity Module – Mobile Equipment (SIM- ME) interface | Release 5 |
| 3GPP TS 51.013 | Test specification for Subscriber Identity Module (SIM) Application Programming Interface (API) for Java Card™ | V5.4.0 |
| 3GPP TS 51.014 | Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM ME) interface | V4.2.0 |
| ETSI TS 102.127 | Transport protocol for CAT applications Stage 2 | V6.9.0 |
| ETSI TS 102.220 | Integrated Circuit Cards (ICC) Numbering system | V6.5.0 |
| ETSI TS 102.221 | Physical and logical characteristics | V8.2.0 |
| ETSI TS 102.222 | Integrated Circuit Cards (ICC); Administrative commands for Telecommunications applications | V6.11.0 |
| ETSI TS 102.223 | Smart cards; Card Application Toolkit (CAT) | V6.5.0 |
| ETSI TS 102.225 | Secured Packet structure for UICC based applications | V6.4.0 |
| ETSI TS 102.226 | Remote APDU Structure for UICC based applications | V6.8.0 |
| ETSI TS 102.230 | Physical, Electrical and Logical tests Specification. | V5.1.0 |
| ETSI TS 102.241 | UICC Application Programming Interface for Java Card™ | V6.12.0 |
| ETSI TS 102.267 | Connection Oriented Service API for Java Card | V7.0.0 |
| ETSI TS 102.268 | Test specification for UICC API | V6.0.0 |
| ETSI TS 102.431 | Test specification for the Transport Protocol of CAT Applications | V7.0.0 |
| ETSI TS 102.671 | Machine-to-machine UICC; Physical and logical characteristics | V9.0.0 |
| ETSI TS 102.613 | UICC – Contactless Front-end (CLF) Interface | V7.3.0 |
| TEC/IR/WS/ESM-101/01/MAR-19 | Telecom Engineering Centre, Government of India, Embedded Subscriber Identity Module (eSIM) Interface Requirement | Date 31st March 2019 |
